20kHz Ultrasonic Tinning Welding Pot (250 X 310 X 135 mm)

• Control: Semi-Automatic
• Cooling Way: Air Cooling
• Style: Portable
• Shipping Cost: Estimated freight per unit.: about shipping cost and estimated delivery time.
• Currency: US$
• Return&refunds: You can apply for a refund up to 30 days after receipt of the products.
• Model NO.: RPS-DS20
• Electrode Stroke: Vertical
• Electric Current: AC
• Welding Spot Number: Single
• Type: Universal
• Frequency: 20kHz
• Maximum Output: 1000W
• Power Supply: 220V / 50-60 Hz
• Temperature Range: 150-400 °c
• Transport Package: Carton
• Trademark: RPS-SONIC
• Origin: China
• HS Code: 8515900090
• Production Capacity: 500PCS/Month
• Package Size: 45.00cm * 27.00cm * 6.00cm
• Package Gross Weight: 6.000kg

Product Description

Basic Info.
Model NO.	RPS-DS20
Conductive Way	One-Sided
Welding Spot Number	Single
Type	Special
Maximum Output	1000W
Temperature Range	150-400
Power Supply	220V / 50-60 Hz
Pot Dimension	20*15cm
Avail Soldering Matrial	ITO Glass, Al, Mo, Cu etc.,
Transport Package	Carton
Specification	20Khz
Trademark	RPS-SONIC
Origin	China
HS Code	8515900090

Model No.			RPS-DS20
Ultrasonic Frequency			20Khz
Maximum Output			100 Watt
Temperature Range			150-400 °C
Power Supply			220V / 50-60 Hz
Ultrasonic Generator		Size	250(W) x 310(L) x 135(H) mm
		Weight	5 Kg
		Feature	Ultrasonic Amplitude Adjustable
Iron Handle Length & Diameter			190mm / Ø20
Avail Soldering Matrial			ITO Glass, AL, Mo, Cu etc.,

   Ultrasonic soldering is a flux-free soldering method. Compared with traditional soldering methods, it is considered more environmentally friendly. Use vibration and cavitation to remove the surface oxide layer from the welding surface instead of chemical agents.

   Ultrasonic soldering technology is different from ultrasonic plastic welding, which uses vibration to generate heat to melt the connected parts. The principle of ultrasonic soldering is basically the same as that of ultrasonic cleaning. The vibration energy causes cavitation in the water bath or cleaning solvent. The surface of the part immersed in the liquid medium is cleaned by the strong erosion effect of cavitation bubbles.

   In the ultrasonic soldering process, heat from a separate energy source melts the solder before applying vibration energy. Then, the molten solder is used as an acoustic transmission medium for ultrasonic vibration. When high-frequency vibration energy is applied to the molten solder, it causes controlled acoustic cavitation at the tip of the soldering tool to destroy and disperse surface oxides. The cavitation microbubbles burst, clean all surfaces, wet the liquid solder and bond the pure metal.

   Vibration also ensures that there are no voids in the solder joints, and the vibration energy forces the liquid solder to penetrate into the gaps and pores of the substrate. It helps seal parts and increase the surface area to which solder can bond. Ultrasonic vibration can also squeeze bubbles out of liquid solder, so this method makes solder joints suitable for applications in high vacuum where sealing is required.

Ultrasonic soldering allows the connection of different materials and can be used for materials that are difficult to solder by conventional methods. Since no flux is required, users can save the time and cost of cleaning flux residues, while reducing corrosion and improving the durability of solder joints.

  The ultrasonic soldering method can be conveniently used for manual welding with the help of a handheld ultrasonic electric soldering iron equipment, or it can be grafted to an ultrasonic welding machine and assembly line
Glass jewelry manufacturing
Optical glasses coating/metallization
Making electrodes on glass and ceramic plates
Welding of heating contacts on the rear window of a car
Welding superconductors, components, ceramic accessories
Vacuum sealing of glass tube, bonding of hardware accessories
Sealing of optical glass fiber (metal ferrule bonding)
The electrode is bonded to the front/back contact of the solar cell (crystalline, thin film)
Bonding leads (dots) in metallic glass, liquid crystal glass, crystal oscillator, hybrid integrated circuit