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| Basic Info. | |
| Condition | New |
| Frequency | 20kHz |
| Amplitude of Vibration | 30um |
| Transport Package | Carton |
| Specification | 45*20*20 |
| Trademark | Rps-sonic |
| Origin | China |
| Production Capacity | 200PCS/Month |
| Model No. | RPS-T20 | |
| Ultrasonic Frequency | 20Khz | |
| Maximum Output | 1000 Watt | |
| Temperature Range | 150 ~ 400 ºC | |
| Power Supply | 220V / 50-60 Hz | |
| Ultrasonic Generator | Size | 72(W) x 65(L) x 355(H) mm |
| Weight | 2Kg | |
| Feature | Ultrasonic Amplitude Adjustable | |
| Pot dimension | 65*8MM | |
| Avail Soldering Matrial | ITO Glass, AL, Mo, Cu etc., | |
Ultrasonic tinning is a kind of welding method that does not use flux. The ultrasonic probe produces cavitation in the molten solder core through mechanical vibration at ultrasonic frequency, and removes the oxide film on the metal surface for smooth and clean tinning.
Ultrasonic tinning is a flux-free connection method in which high-frequency mechanical vibration replaces flux. Ultrasonic tin furnaces of different sizes can be customized according to different welding material sizes of customers. It can also be modified on the basis of the customer's existing tin furnace, adding ultrasonic instead of flux for environmentally friendly tinning.
We offer a variety of methods to acoustically activate molten metal. Another popular method is to immerse a Power Probe's Wear-Tip directly into the molten material. The ultrasonic energy will remove dissolved gases and enhance grain structure refinement. The Permendur Power Probe offers the ability to acoustically activate molten metal in continuous or batch casting operations.
Ultrasonic soldering is used to join materials with either a metallurgical or mechanical bond.
A metallurgical bond is formed when the oxide from the base metal is removed through ultrasonic cavitation and implosion in the solder. The solder then comes in to contact with the base metal and the ionic attraction between the two forms a bond. A tin or lead solder bonded to copper is an example of this.
A mechanical bond usually involves no oxide on the base material. The cavitation and implosion in the solder create forces that agitate the materials and form an interlocking mechanical bond.
Coating a ceramic with solder is an example of this process.
When to use Ultrasonic Soldering
There are two main reasons for using Ultrasonic Soldering:
1. To eliminate the need for flux in the soldering process
2. To apply solder to ceramics and similar materials
The advantages of removing flux from the process are that there is no need for post-process
cleaning and wicking caused by surface tension from the flux is removed. Eliminating post-process
cleaning has the obvious benefit of cost saving for both the process and the flux itself. The benefit of
eliminating wicking is that the solder coating on the base material can be better controlled.
Aluminum components
Ferrite components
Glass components
Silicon wafers
Ceramic components
Semiconductor chips
Metals etc.
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