Fluxless Soldering by 20kHz Ultrasonic Soldering Pot for Wire Tinning System

• Application: Tinning
• Cooling Way: Air Cooling
• Control: Semi-Automatic
• Shipping Cost: Estimated freight per unit.: about shipping cost and estimated delivery time.
• Currency: US$
• Return&refunds: You can apply for a refund up to 30 days after receipt of the products.
• Model NO.: DS20
• Frequency Range: 1000W
• Power: Ultrasonic
• Frequency: 20kHz
• Amplitude of Vibration: 30um
• Maximum Output: 1000 Watt
• Temperature Range: 150 ~ 400 °c
• Transport Package: Carton
• Trademark: Rps-sonic
• Origin: China
• HS Code: 8515900090
• Production Capacity: 200PCS/Month
• Package Size: 45.00cm * 22.00cm * 25.00cm
• Package Gross Weight: 6.000kg

Product Description

Fluxless Soldering by 20khz Ultrasonic Soldering Pot for Wire Tinning System

 

We offer a variety of methods to acoustically activate molten metal. Another popular method is to immerse a Power Probe's Wear-Tip directly into the molten material. The ultrasonic energy will remove dissolved gases and enhance grain structure refinement. The Permendur Power Probe offers the ability to acoustically activate molten metal in continuous or batch casting operations.

 

Ultrasonic soldering is used to join materials with either a metallurgical or mechanical bond.

A metallurgical bond is formed when the oxide from the base metal is removed through ultrasonic cavitation and implosion in the solder. The solder then comes in to contact with the base metal and the ionic attraction between the two forms a bond. A tin or lead solder bonded to copper is an example of this. 

A mechanical bond usually involves no oxide on the base material. The cavitation and implosion in the solder create forces that agitate the materials and form an interlocking mechanical bond.

Coating a ceramic with solder is an example of this process.

 

When to use Ultrasonic Soldering

There are two main reasons for using Ultrasonic Soldering:

1. To eliminate the need for flux in the soldering process

2. To apply solder to ceramics and similar materials

The advantages of removing flux from the process are that there is no need for post-process

cleaning and wicking caused by surface tension from the flux is removed. Eliminating post-process

cleaning has the obvious benefit of cost saving for both the process and the flux itself. The benefit of

eliminating wicking is that the solder coating on the base material can be better controlled.

Model No.		RPS-DS20
Ultrasonic Frequency		20Khz
Maximum Output		1000 Watt
Temperature Range		150 ~ 400 °C
Power Supply		220V / 50-60 Hz
Ultrasonic Generator	Size	250(W) x 310(L) x 135(H) mm
	Weight	5 Kg
	Feature	Ultrasonic Amplitude Adjustable
Pot dimension		20*15cm
Avail Soldering Matrial		ITO Glass, AL, Mo, Cu etc.,

 

Characteristics 

• Easy soldering upon un-bondable material (metal, glass, ceramics) by simple dipping process.

• No need for flux

• Reliable bonding/sealing

• Best used in difficult, small-surface places with limited access

• Aluminum components

• Ferrite components

• Glass components

• Silicon wafers

• Ceramic components

• Semiconductor chips

• Metals etc.