20kHz Ultrasonic Tinning Ultrasonic Soldering Iron Machine

• Customization: Available
• After-sales Service: Provided
• Warranty: 1 Year
• Model NO.: RPS-T20
• Metal Material: Steel
• Outlet Diameter: Diameter190mm/ Ø20
• Condition: New
• Frequency: 60kHz
• Power: 100W
• HS: 8515900090
• Avail Soldering Matrial: ITO Glass, Al, Mo, Cu etc.
• Transport Package: Carton
• Specification: 45*22*27
• Trademark: RPS-sonic
• Origin: China
• HS Code: 8515900090
• Production Capacity: 100
• Package Size: 50.00cm * 30.00cm * 30.00cm
• Package Gross Weight: 7.000kg

Product Description

   Ultrasonic tinning Ultrasonic Soldering Iron machine

Product Description

 

Model No.		HC-SI60
Ultrasonic Frequency		60Khz
Maximum Output		100 Watt
Temperature Range		150 ~ 400 °C
Power Supply		220V / 50-60 Hz
Iron Handle Length		Diameter190mm/ Ø20
Avail Soldering Matrial		ITO Glass, AL, Mo, Cu etc.,

Ultrasonic soldering is a flux-free soldering method that is considered more environmentally friendly than conventional soldering methods. Use vibration and cavitation to remove surface oxide layers from welding surfaces, not chemicals.

Ultrasonic soldering technology is different from ultrasonic plastic welding, which uses vibration to generate heat to melt the connected parts. The principle of use of ultrasonic soldering is basically the same as the process of ultrasonic cleaning. The vibration energy causes cavitation in the water bath or cleaning solvent. For the part immersed in the liquid medium, the surface is cleaned by the strong erosion action of cavitation bubbles.

During ultrasonic soldering, heat from a separate energy source melts the solder prior to applying vibrational energy. The molten solder is then used as an acoustic transmission medium for ultrasonic vibrations. When high frequency vibrational energy is applied to molten solder, controlled acoustic cavitation is induced at the tip of the soldering tool in order to destroy and disperse surface oxides. Cavitation microbubbles burst, cleaning all surfaces, allowing liquid solder to wet and bond pure metal.

The vibration also ensures that the solder joints are free of voids, and the vibration energy forces the liquid solder to penetrate into the crevices and pores of the substrate. It helps seal the part and increases the surface area where the solder can bond. Ultrasonic vibration can also squeeze air bubbles out of the liquid solder, so this method makes the solder joint suitable for high vacuum applications where sealing is required.

Ultrasonic soldering allows dissimilar materials to be joined and can be used for materials that are difficult to solder with conventional methods. By eliminating the need for flux, users can save time and cost in cleaning flux residues, while reducing corrosion and improving the durability of soldered joints.

The ultrasonic soldering method can be conveniently used for manual soldering with the help of hand-held ultrasonic electric soldering iron equipment, and can also be grafted to ultrasonic welding machines and assembly lines.
   



Glass, ceramic, stainless steel, aluminum welding

After years of extensive research into glass-to-metal bonding, Japanese engineers developed a special solder alloy called CERASOLZER (solder wire). This reactive solder alloy is specially formulated to cooperate with ultrasonic welding methods, and has a very unique bonding ability, which can replace the commonly used silver baking, indium brazing, molybdenum manganese and resin bonding methods. CERASOLZER Bonding (Glass Substrate) In addition to direct metal-to-metal bonding, Cerasolzer can also form strong chemical bonds with soldered substrates. The alloy consists of the same main components as standard solder alloys (lead/tin), but in addition it also contains small amounts of elements such as zinc, titanium, silicon, aluminum, beryllium, rare earths, etc. Strong chemical affinity.

During the welding process, these additional elements combine with the surrounding oxygen to form an oxide that chemically bonds to a variety of materials, including glass, ceramics, aluminum, stainless steel, conductive oxides and many formerly Other substrates considered non-solderable. The resulting oxides bond with the solder substrate, forming extremely strong chemical bonds (RO) at the interface.

Therefore, if the oxygen is effectively eliminated by replacing the air surrounding the bonding device with an inert gas such as nitrogen, the Cerasolzer's adhesion will be lost. The results show that the suitable critical oxygen concentration for bonding is about 2%. The melting temperature of Cerasolzer alloy is between 155 and 297°C, and the welding method is flux-free due to ultrasonic vibration. In fact, if our ultrasonic welding method uses flux, it will destroy the oxygen bond and destroy the whole welding process, so it should not be used.

Glass jewelry manufacturing
Optical glasses coating/metallization
Making electrodes on glass and ceramic plates
Heating contact welding in car rear window
Welding superconductors, components, ceramic accessories
Glass tube vacuum sealing, hardware accessories bonding
Sealing of optical glass fibers (ferrule bonding)
Electrode bonding to front/back contacts of solar cells (crystalline, thin film)
Lead (dot) bonding on metallic glass, liquid crystal glass, crystal oscillator, hybrid integrated circuit